|
Item |
CP12 prober |
|
Dimension |
1620mm(W) *1230（D）*1450mm(H) |
|
Wafer |
200mm,300mm |
|
Wafer thickness |
250~2000μm |
|
Die Size |
350μm ~76,000μm |
|
Transfer mode |
Vacuum suction, dual arms |
|
Accuracy |
XY：±1.5μm；Z：±2.5μm |
|
XY platform |
Probing area ± 170mm, repeated positioning accuracy ± 1μm |
|
Z axis |
Repeated positioning accuracy ± 1.5μm, max speed 30mm/s |
|
Force |
50kg (optional 200kg) |
|
Calibration |
Image calibration, with high/low–power template |
|
Index time |
240ms (based on die size 6mm,Z clearance 0.5mm) |
|
Test temperature |
Ambient~150℃±1℃ |
|
Communication interface |
GPIB, reserved TTL and RS232 |
|
Option |
ID reading, auto card exchange |
※Refer to the prober for CIS and SOC device.
Copyright: Hangzhou ChangChuan Technology Co.,Ltd. Address: No. 410 Jucai Road, Binjiang District, Hangzhou
Tel: +86-571-85096193 Fax: +86-571-88830180 Technical support: GXR Network
